Light and heat resistant circuit board apparatus and method

摘要

A light and heat resistant circuit board apparatus LHRPCB, comprising: at least one thermally conductive material (TCM) layer (20) adapted to serve as a mechanical and thermal substrate for the LHRPCB; at least one layer (30) of electrically isolating material (EIM) configurable on respective TCM layers, the at least one EIM layer being resistant to UV radiation; at least one electrically conducting (ECL) layer (35) configurable above the at least one TCM layer and adapted to be patterned and to selectively conduct electrical current; at least one heat and UV radiation resistant bonding (HUVRBL) layer (25) appliable between respective ECL, TCM, and EIM layers; and at least one electronic component (45,51) mountable upon the at least one ECL layer, wherein the LHRPCB is adapted to be exposed to light and heat for an extended period.