发明名称 |
SEMICONDUCTOR PACKAGES HAVING LEAD FRAMES |
摘要 |
PURPOSE: A semiconductor package having a lead frame is provided to steadily load a semiconductor chip by doubly supporting the semiconductor chip through a first frame and a second frame. CONSTITUTION: A semiconductor chip(140) is mounted in a lead frame. The lead frame is electrically connected to the semiconductor chip by a plurality of bonding wires. The lead frame comprises a first lead frame and a second lead frame. The first lead frame and the second lead frame support the semiconductor chip. A mold layer(160) molds the semiconductor chip and the lead frame. The first lead frame has outer leads projected from the mold layer. The first lead frame is combined with the second lead frame by an insulating adhesive layer. The second lead frame has a die pad of plate type. |
申请公布号 |
KR20120090622(A) |
申请公布日期 |
2012.08.17 |
申请号 |
KR20110011148 |
申请日期 |
2011.02.08 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JUNG, EUN HEE |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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