<p>PURPOSE: A semiconductor package is provided to improve the filling performance of underfill materials by rapidly inducing the filling speed of the underfill materials which are filled between a semiconductor chip and a substrate. CONSTITUTION: A conductive circuit pattern(14) is formed on the surface of a base resin layer(12) in a substrate. An oxide film layer(18) is formed on the rest surface excluding a bump attachment surface(16) from the whole surface of the conductive circuit pattern. Underfill materials(28) are filled within a stand-off height. A channel eliminates air between conductive circuit patterns in the filling of the underfill materials. A solder resist(32) covers the conductive circuit pattern.</p>
