| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a processing method of a substrate which enables a surface supporting the substrate to be processed. <P>SOLUTION: A processing method of a substrate includes: a first adhesion process in which a ring shaped first supporting member 1 which is formed along an outer periphery of a substrate 2 is adhered to a first surface of the substrate 2; a first processing process in which the substrate 2 is processed; and a first separation process in which the first supporting member 1 is separated from the substrate 2. Further, the first support member 1 has light transmissivity, and the first supporting member 1 is adhered to the substrate 2 with an adhesive or an adhesive tape which can be peeled off by UV light or high temperature heating. <P>COPYRIGHT: (C)2012,JPO&INPIT |
