| 摘要 |
<P>PROBLEM TO BE SOLVED: To increase a polishing rate and prevent a workpiece from being scratched in a workpiece polishing device. <P>SOLUTION: This polishing device 1 includes a machine body 2, a lower surface plate 3 having a polishing upper surface rotatable with respect to the machine body 2 and about the vertical rotating axis CT1, and a workpiece support member 9 capable of holding a workpiece W on the upper side of the polishing upper surface. The workpiece support member 9 is configured so as to be able to revolve the workpiece W held on the workpiece support member 9 with respect to the machine body 2 and about the vertical revolving axis which is decentered from the center of the workpiece W. Consequently, even if the revolving speed of the workpiece W is increased, the scattering of abrasive due to centrifugal force can be suppressed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
