发明名称 |
LIGHT-EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A light-emitting device package and a method of manufacturing the light-emitting device package. The light-emitting device package includes a wiring substrate; a Zener diode mounted on a first region of the wiring substrate; a light-emitting device chip mounted on the first region and a second region of the wiring substrate; and a molding member for fixing at least a portion of the wiring substrate, wherein the Zener diode is embedded in the molding member. |
申请公布号 |
US2012205699(A1) |
申请公布日期 |
2012.08.16 |
申请号 |
US201213365922 |
申请日期 |
2012.02.03 |
申请人 |
YOO CHEOL-JUN;SONG YOUNG-HEE |
发明人 |
YOO CHEOL-JUN;SONG YOUNG-HEE |
分类号 |
H01L33/62;H01L33/50;H01L33/58 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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