发明名称 Positive resist composition and pattern-forming method using the same
摘要 A positive resist composition comprising (A) resin having a monocyclic or polycyclic alicyclic hydrocarbon structure and capable of decomposing by the action of an acid to increase the solubility in an alkaline developer, (B) a compound capable of generating an acid upon treatment with one of an actinic ray and radiation and (F) a specific surfactant containing a fluorine atom in an amount of from 30 to 60 mass %, and a pattern-forming method using the same.
申请公布号 US8241833(B2) 申请公布日期 2012.08.14
申请号 US20100785019 申请日期 2010.05.21
申请人 KANDA HIROMI;NISHIYAMA FUMIYUKI;FUJIFILM CORPORATION 发明人 KANDA HIROMI;NISHIYAMA FUMIYUKI
分类号 G03C1/00;G03C7/00;G03F7/00 主分类号 G03C1/00
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