发明名称 |
Positive resist composition and pattern-forming method using the same |
摘要 |
A positive resist composition comprising (A) resin having a monocyclic or polycyclic alicyclic hydrocarbon structure and capable of decomposing by the action of an acid to increase the solubility in an alkaline developer, (B) a compound capable of generating an acid upon treatment with one of an actinic ray and radiation and (F) a specific surfactant containing a fluorine atom in an amount of from 30 to 60 mass %, and a pattern-forming method using the same.
|
申请公布号 |
US8241833(B2) |
申请公布日期 |
2012.08.14 |
申请号 |
US20100785019 |
申请日期 |
2010.05.21 |
申请人 |
KANDA HIROMI;NISHIYAMA FUMIYUKI;FUJIFILM CORPORATION |
发明人 |
KANDA HIROMI;NISHIYAMA FUMIYUKI |
分类号 |
G03C1/00;G03C7/00;G03F7/00 |
主分类号 |
G03C1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|