| 发明名称 |
Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications |
| 摘要 |
An embodiment of the present invention is a technique to form a resin. A mixture is formed by a curing agent dissolved in the epoxy resin. The epoxy resin contains a first rigid rod mesogen. The curing agent contains a second rigid rod mesogen and one of a hydroxyl, amine, and anhydride. |
| 申请公布号 |
US8242216(B2) |
申请公布日期 |
2012.08.14 |
| 申请号 |
US201113169784 |
申请日期 |
2011.06.27 |
| 申请人 |
MATAYABAS, JR. JAMES C.;CHEN TIAN-AN;INTEL CORPORATION |
发明人 |
MATAYABAS, JR. JAMES C.;CHEN TIAN-AN |
| 分类号 |
C08L63/00;C08G59/14;C08G59/18;C08G59/20 |
主分类号 |
C08L63/00 |
| 代理机构 |
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