发明名称 Imaging of deep structures of reliefs for shallow relief embossing
摘要 A variety of deep structured decorative patterns originate with mechanical relief or etching. The present method incorporates a deeply patterned or textured etching or relief into a thin film embossing shim to simulate the look of the deep pattern or texture when used to emboss thin film or material. A transparent mold of the relief surface (such as brushed metal, engine-turned patterns, and textured glass) is formed using UV curable liquid and a transparent substrate. The relief copy in the transparent mold or overlay is mapped onto a photoresist surface or plate by shining or expanding one or more laser lights or laser beams through the transparent mold. The different heights of the relief copy of the transparent mold will cause the light to diffract/refract to form a corresponding patterned etching in the photoresist plate. The resulting photoresist plate is then metalized and electroplated to form a thin film embossing shim. The thin film embossing shim is then used with conventional embossing equipment to form thin film embossings. The embossed thin films can then be metalized and laminated onto substrate to create a product that has shifting patterns that reflect at a variety of viewing angles when (observed under normal lighting conditions) exposed to white light.
申请公布号 US8241479(B2) 申请公布日期 2012.08.14
申请号 US20090493836 申请日期 2009.06.29
申请人 SPOTO LOUIS M.;RANDAZZO DEAN J.;DESCHNER MATT;ILLINOIS TOOL WORKS INC. 发明人 SPOTO LOUIS M.;RANDAZZO DEAN J.;DESCHNER MATT
分类号 C25D1/00 主分类号 C25D1/00
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