发明名称 |
Housing for electronic device and method of making the housing |
摘要 |
A method of making a housing, comprising the steps of: providing a transparent plastic substrate, the substrate having an outer surface and an inner surface; coating at least portions of the outer surface with a photosensitizer; activating the substrate by using an energy ray to irradiate areas of the outer surface covered with the photosensitizer to form a conductive medium layer thereon; electroplating the activated substrate, an electroplated coating formed on the irradiated area in a predetermined pattern; forming an electrophoretic coating on the surface of the electroplated coating by an electrophoresis process; and forming a paint coating on the inner surface of the substrate. A housing made by the present method is provided. |
申请公布号 |
US8241480(B2) |
申请公布日期 |
2012.08.14 |
申请号 |
US20090563246 |
申请日期 |
2009.09.21 |
申请人 |
HUANG GANG;WANG YAN-MIN;WANG QIANG;SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.;FIH (HONG KONG) LIMITED |
发明人 |
HUANG GANG;WANG YAN-MIN;WANG QIANG |
分类号 |
C25D5/02;B01D57/02 |
主分类号 |
C25D5/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|