发明名称 Housing for electronic device and method of making the housing
摘要 A method of making a housing, comprising the steps of: providing a transparent plastic substrate, the substrate having an outer surface and an inner surface; coating at least portions of the outer surface with a photosensitizer; activating the substrate by using an energy ray to irradiate areas of the outer surface covered with the photosensitizer to form a conductive medium layer thereon; electroplating the activated substrate, an electroplated coating formed on the irradiated area in a predetermined pattern; forming an electrophoretic coating on the surface of the electroplated coating by an electrophoresis process; and forming a paint coating on the inner surface of the substrate. A housing made by the present method is provided.
申请公布号 US8241480(B2) 申请公布日期 2012.08.14
申请号 US20090563246 申请日期 2009.09.21
申请人 HUANG GANG;WANG YAN-MIN;WANG QIANG;SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.;FIH (HONG KONG) LIMITED 发明人 HUANG GANG;WANG YAN-MIN;WANG QIANG
分类号 C25D5/02;B01D57/02 主分类号 C25D5/02
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