发明名称 TEST SOCKET ASSEMBLY FOR HEAT PACKAGE
摘要 PURPOSE: A test socket assembly for a heating package is provided to have various sensors, thereby easily attaching/detaching the heating package and easily checking the heating package. CONSTITUTION: A heating package is mounted in a main heat sink(100). The main heat sink absorbs heat of the heating package and discharges the heat to the outside. A test board(400) is combined with one side of the main heat sink and tests the heating package. A lower heating unit is coupled with one side of the main heat sink or the test board and assists the discharging of heat of the heating package. A pressurization unit(300) pressurizes the heating package and closely contacts the heating package with the main heat sink. A contact unit(200) connects the heating package with the test board. A sub heat sink(500) is coupled with the outside of the other side of the main heat sink and assists discharging of heat of the main heat sink.
申请公布号 KR101173192(B1) 申请公布日期 2012.08.10
申请号 KR20110046229 申请日期 2011.05.17
申请人 OKINS ELECTRONICS CO., LTD. 发明人 JUN, JIN GUK;PARK, SUNG KYU;MIN, SEONG KYU
分类号 H01R33/76;H01L21/66;H05K9/00 主分类号 H01R33/76
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