发明名称 |
TEST SOCKET ASSEMBLY FOR HEAT PACKAGE |
摘要 |
PURPOSE: A test socket assembly for a heating package is provided to have various sensors, thereby easily attaching/detaching the heating package and easily checking the heating package. CONSTITUTION: A heating package is mounted in a main heat sink(100). The main heat sink absorbs heat of the heating package and discharges the heat to the outside. A test board(400) is combined with one side of the main heat sink and tests the heating package. A lower heating unit is coupled with one side of the main heat sink or the test board and assists the discharging of heat of the heating package. A pressurization unit(300) pressurizes the heating package and closely contacts the heating package with the main heat sink. A contact unit(200) connects the heating package with the test board. A sub heat sink(500) is coupled with the outside of the other side of the main heat sink and assists discharging of heat of the main heat sink.
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申请公布号 |
KR101173192(B1) |
申请公布日期 |
2012.08.10 |
申请号 |
KR20110046229 |
申请日期 |
2011.05.17 |
申请人 |
OKINS ELECTRONICS CO., LTD. |
发明人 |
JUN, JIN GUK;PARK, SUNG KYU;MIN, SEONG KYU |
分类号 |
H01R33/76;H01L21/66;H05K9/00 |
主分类号 |
H01R33/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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