发明名称 SUPPORT METHOD OF SOLDERING PRINT STATE ANALYSIS WORK AND SOLDERING PRINT TESTER
摘要 In a solder printing inspection machine (100), an identification code and an inspection time of an inspection target board are accumulated in a memory in each time, and the accumulated data whose identification code is matched with that of the current inspection target board is searched. When the corresponding board is found, it is recognized that the board is extracted because of the defective board and the inspection target board is one that the extracted board is reintroduced. A graph in which pieces of information expressing the pieces of quality of the boards are arrayed in time series is produced based on each time of inspection result, and the graph is displayed on a monitor. In the pieces of data included in the graph, the data corresponding to the board that is recognized as the reintroduction is explicitly shown by a letter "R".
申请公布号 KR101172999(B1) 申请公布日期 2012.08.09
申请号 KR20110006708 申请日期 2011.01.24
申请人 发明人
分类号 B23K1/00;G01B11/24;G06T7/00;H05K3/34 主分类号 B23K1/00
代理机构 代理人
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