发明名称 |
LEAD-FREE SOLDER ALLOY, CONNECTING MEMBER AND A METHOD FOR ITS MANUFACTURE, AND ELECTRONIC PART |
摘要 |
A lead-free solder which can reduce the occurrence of voids and a connecting member which uses the solder and has excellent adhesion, bonding strength, and workability are provided. The lead-free solder alloy has a composition consisting essentially of Sn: 0.1-3% and/or Bi: 0.1-2%, and a remainder of In and unavoidable impurities and has the effect of suppressing the occurrence of voids at the time of soldering. The connecting member is prepared by melting the lead-free solder alloy, immersing a metal substrate in the melt, and applying ultrasonic vibrations to the molten lead-free solder alloy and the metal substrate to form a lead-free solder alloy layer on the surface of the metal substrate. A heat sink and a package are soldered to each other through this connecting member by reflow heating in the presence of flux.
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申请公布号 |
US2012199393(A1) |
申请公布日期 |
2012.08.09 |
申请号 |
US201013261199 |
申请日期 |
2010.09.02 |
申请人 |
YOSHIKAWA SHUNSAKU;YAMANAKA YOSHIE;OHNISHI TSUKASA;ISHIBASHI SEIKO;WATANABE KOJI;ISHIKAWA HIROKI;CHIBA YUTAKA |
发明人 |
YOSHIKAWA SHUNSAKU;YAMANAKA YOSHIE;OHNISHI TSUKASA;ISHIBASHI SEIKO;WATANABE KOJI;ISHIKAWA HIROKI;CHIBA YUTAKA |
分类号 |
H01R4/02;B23K1/20;C22C28/00 |
主分类号 |
H01R4/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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