发明名称 Substrate processing apparatus and method for manufacturing semiconductor device
摘要 A substrate processing apparatus and a method for manufacturing a semiconductor device whereby foreign matter can be prevented from being adsorbed on the substrate, by suppressing agitation of foreign matter present in the processing chamber. The substrate processing apparatus comprises a processing chamber for processing a substrate; a processing gas feeding line for feeding a processing gas into the processing chamber; an inert gas feeding line for feeding an inert gas into the processing chamber; an inert gas vent line provided in the inert gas feeding line, for exhausting the inert gas fed into the inert gas feeding line without feeding the inert gas into the processing chamber; a first valve provided in the inert gas feeding line, on a downstream side of a part where the inert gas vent line is provided in the inert gas feeding line; a second valve provided in the inert gas vent line; and an exhaust line that exhausts an inside of the processing chamber.
申请公布号 US8235001(B2) 申请公布日期 2012.08.07
申请号 US20080076508 申请日期 2008.03.19
申请人 SANO ATSUSHI;ITATANI HIDEHARU;TANABE MITSURO;HITACHI KOKUSAI ELECTRIC INC. 发明人 SANO ATSUSHI;ITATANI HIDEHARU;TANABE MITSURO
分类号 C23C16/455;C23C16/06;C23C16/22;C23C16/52 主分类号 C23C16/455
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