发明名称 Manufacturing method of semiconductor device
摘要 It is an object to provide a manufacturing method of a structure of a thin film transistor including an oxide semiconductor film, in which threshold voltage at which a channel is formed is positive and as close to 0 V as possible. A protective insulating layer is formed to cover a thin film transistor including an oxide semiconductor layer that is dehydrated or dehydrogenated by first heat treatment, and second heat treatment at a temperature that is lower than that of the first heat treatment, in which the increase and decrease in temperature are repeated plural times, is performed, whereby a thin film transistor including an oxide semiconductor layer, in which threshold voltage at which a channel is formed is positive and as close to 0 V as possible without depending on the channel length, can be manufactured.
申请公布号 US8236627(B2) 申请公布日期 2012.08.07
申请号 US20100871122 申请日期 2010.08.30
申请人 TSUBUKU MASASHI;YOSHITOMI SHUHEI;TUJI TAKAHIRO;HOSOBA MIYUKI;SAKATA JUNICHIRO;TOMATSU HIROYUKI;HAYAKAWA MASAHIKO;SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 TSUBUKU MASASHI;YOSHITOMI SHUHEI;TUJI TAKAHIRO;HOSOBA MIYUKI;SAKATA JUNICHIRO;TOMATSU HIROYUKI;HAYAKAWA MASAHIKO
分类号 H01L21/00;H01L21/335;H01L21/84 主分类号 H01L21/00
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