| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology capable of enhancing the reliability of a package configuring a semiconductor device. <P>SOLUTION: A heat sink unit HSU and an outer lead unit OLU are separated, a chip mounting part TAB is provided in the outer lead unit OLU, and the chip mounting part TAB is connected with a heat sink HS. Since a connection part CON functions as a stopper for preventing resin leakage when a sealed body is formed by a resin sealing step, resin burrs can be prevented from being formed in a package product. Furthermore, since camber is not generated in the heat sink unit HSU, generation of crack in the sealed body due to the swell (camber) can be suppressed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
