发明名称 |
SUBSTRATE COOLING DEVICE, SPUTTERING APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE |
摘要 |
A substrate cooling device includes: a substrate holding stage including a recess defining a space between a substrate mounting unit and a substrate mounted on the substrate mounting unit; a holding member that exerts a pressing force against the substrate holding stage so as to fix the substrate to the substrate holding stage; a refrigerator connected to the substrate holding stage; a coolant gas inlet path including a coolant gas inlet opening that is provided at the substrate holding stage and opens to a recessed face of the recess, the coolant gas inlet path connecting a space in the recess via the coolant gas inlet opening to a coolant gas supply; and a coolant gas outlet path including a coolant gas outlet opening that is provided at the substrate holding stage independently of the coolant gas inlet opening and opens to the recessed face of the recess. |
申请公布号 |
US2012193216(A1) |
申请公布日期 |
2012.08.02 |
申请号 |
US201213439397 |
申请日期 |
2012.04.04 |
申请人 |
CANON ANELVA CORPORATION |
发明人 |
ENDO TETSUYA;ABARRA EINSTEIN NOEL |
分类号 |
C23C14/34;F25B9/14;F25D17/04 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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