发明名称 Deep trench insulated gate bipolar transistor
摘要 <p>In one embodiment, a power transistor device comprises a substrate of a first conductivity type that forms a PN junction with an overlying buffer layer of a second conductivity type. The power transistor device further includes a first region of the second conductivity type, a drift region of the second conductivity type that adjoins a top surface of the buffer layer, and a body region of the first conductivity type. The body region separates the first region from the drift region. First and second dielectric regions respectively adjoin opposing lateral sidewall portions of the drift region. The dielectric regions extend in a vertical direction from at least just beneath the body region down at least into the buffer layer. A trench gate that controls forward conduction is disposed above the dielectric region adjacent to and insulated from the body region.</p>
申请公布号 EP2482324(A2) 申请公布日期 2012.08.01
申请号 EP20120165167 申请日期 2009.12.18
申请人 POWER INTEGRATIONS, INC. 发明人 PARTHASARATHY, VIJAY;BANERJEE, SUJIT
分类号 H01L29/739 主分类号 H01L29/739
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