发明名称 |
Packaged semiconductor assemblies and methods for manufacturing such assemblies |
摘要 |
Packaged semiconductor assemblies including interconnect structures and methods for forming such interconnect structures are disclosed herein. One embodiment of a packaged semiconductor assembly includes a support member having a first bond-site and a die carried by the support member having a second bond-site. An interconnect structure is connected between the first and second bond-sites and includes a wire that is coupled to at least one of the first and second bond-sites. The interconnect structure also includes a third bond-site coupled to the wire between the first and second bond-sites.
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申请公布号 |
US8232657(B2) |
申请公布日期 |
2012.07.31 |
申请号 |
US20100973607 |
申请日期 |
2010.12.20 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
BOON SUAN JEUNG;ENG MEOW KOON;CHIA YONG POO |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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