发明名称 |
Lead free solder interconnections for integrated circuits |
摘要 |
Lead free solder interconnections for integrated circuits. A copper column extends from an input/output terminal of an integrated circuit. A cap layer of material is formed on the input/output terminal of the integrated circuit. A lead free solder connector is formed on the cap layer. A substrate having a metal finish solder pad is aligned with the solder connector. An intermetallic compound is formed at the interface between the cap layer and the lead free solder connector. A solder connection is formed between the input/output terminal of the integrated circuit and the metal finish pad that is less than 0.5 weight percent copper, and the intermetallic compound is substantially free of copper.
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申请公布号 |
US8232643(B2) |
申请公布日期 |
2012.07.31 |
申请号 |
US20100729021 |
申请日期 |
2010.03.22 |
申请人 |
CHUANG YAO-CHUN;HSIAO CHING-WEN;KUO CHEN-CHENG;CHEN CHEN-SHIEN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHUANG YAO-CHUN;HSIAO CHING-WEN;KUO CHEN-CHENG;CHEN CHEN-SHIEN |
分类号 |
H01L23/488;H01L21/60;H01L23/31 |
主分类号 |
H01L23/488 |
代理机构 |
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地址 |
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