Insulated metal substrates incorporating advanced cooling,申请号US20090433301-传众专利搜索

发明名称	Insulated metal substrates incorporating advanced cooling
摘要	A power module includes one or more semiconductor power devices bonded to an insulated metal substrate (IMS). A plurality of cooling fluid channels is integrated into the IMS.
申请公布号	US8232637(B2)	申请公布日期	2012.07.31
申请号	US20090433301	申请日期	2009.04.30
申请人	BEAUPRE RICHARD ALFRED;LOSEE PETER ALMERN;SHEN XIAOCHUN;GLASER JOHN STANLEY;SMOLENSKI JOSEPH LUCIAN;PAUTSCH ADAM GREGORY;GENERAL ELECTRIC COMPANY	发明人	BEAUPRE RICHARD ALFRED;LOSEE PETER ALMERN;SHEN XIAOCHUN;GLASER JOHN STANLEY;SMOLENSKI JOSEPH LUCIAN;PAUTSCH ADAM GREGORY
分类号	H01L23/34	主分类号	H01L23/34
代理机构		代理人
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