SEMICONDUCTOR PACKAGING MOLD CLEANING APPARATUS

摘要

PURPOSE: A cleaning apparatus for a semiconductor packaging mold is provided to improve productivity by cleaning a semiconductor mold without separating from an ejector. CONSTITUTION: A fixing plate(10) moves horizontally and vertically in order to wash a semiconductor mold. A chamber is installed in the fixing plate and prevents a cleaning liquid from being scattered to the outside. A cleaning liquid injection part is installed in the fixing plate and sprays the cleaning liquid inside the chamber. A brush(40) revolves and vibrates while being installed inside the chamber and eliminates foreign materials from the surface of the semiconductor mold. An exhausting part(50) discharges the foreign materials and the cleaning liquid removed from the semiconductor mold to the outside.