| 摘要 |
The present invention provides a dicing die-bonding film which is excellent in balance between holding strength of a semiconductor wafer upon dicing and peeling property upon picking up. A dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a base material, and a die-bonding film formed on the dicing film,, wherein the pressure-sensitive adhesive layer contains a polymer obtained by the addition reaction of an acrylic polymer containing 10 to 40 mol% of a hydroxyl group-containing monomer with 70 to 90 mol% of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and 2 to 20 parts by weight of a crosslinking agent including in the molecule two or more functional groups having reactivity with a hydroxyl group based on 100 parts by weight of the polymer, and the pressure-sensitive adhesive layer is also cured by irradiation with ultraviolet rays under predetermined conditions, and wherein the die-bonding film comprises an epoxy resin, and is also bonded on the pressure-sensitive adhesive layer after irradiation with ultraviolet rays. |
