| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which an electrode of a semiconductor element is electrically connected to a connection pad via a solder bump and electromigration is effectively inhibited. <P>SOLUTION: A semiconductor device comprises; a semiconductor element in which an electronic circuit 2 is directly connected to a part of a circumference of an electrode 3 of a semiconductor substrate 1; a wiring board 4 provided with a connection pad 5 arranged to face the electrode 3 of the semiconductor element; and a solder bump 6 sandwiched between the electrode 3 and the connection pad 5 and bonded to the electrode 3 and the connection pad 5. A nickel layer 7 lies along a boundary between the electrode 3 and the solder bump 6, and has a thickness larger than that at another portion, at a portion contacting a part of an outer periphery of the electrode 3, which is connected to the electronic circuit 2. A current density of a current flowing in the solder bump 6 is uniformed based on an electrical resistance difference depending on a difference in thicknesses of the nickel layer 7 and migration caused by current concentration can be inhibited. <P>COPYRIGHT: (C)2012,JPO&INPIT |
