| 摘要 |
<p>The present invention addresses the problem of providing a heat-resistant adhesive tape for semiconductor package manufacturing steps, which is used in semiconductor package manufacturing steps, has excellent reworkability at the time of attaching the tape at a room temperature, and which is capable of preventing a resin from leaking in a resin sealing step under a high-temperature atmosphere. In order to solve the problem, the present invention provides a heat-resistant adhesive tape for semiconductor package manufacturing steps, which is used by being adhered to a semiconductor chip at the time of resin-sealing the semiconductor chip, has a base material layer and an adhesive layer, has excellent wettability, while being slightly adhesive at a room temperature, and which has improved adhesive force under a high-temperature atmosphere after being heated.</p> |
