| 摘要 |
<P>PROBLEM TO BE SOLVED: To overcome limitations and disadvantages by providing compositions and processes for removing polymers, post-etch residues, and post-oxygen-ashing residues, particularly from ICs, WLP circuits on wafer substrates, and PCBs. <P>SOLUTION: Improved compositions and processes for removing photoresists, polymers, post-etch residues, and post-oxygen-ashing residues from interconnect, wafer level packaging, and printed circuit board substrates are disclosed. One process comprises contacting such substrates with mixtures containing: an effective amount of organic ammonium compound(s); about 2-20 mass% of oxammonium compound(s); optionally organic solvent(s); and water. <P>COPYRIGHT: (C)2012,JPO&INPIT |
