| 摘要 |
PURPOSE: A lead frame and a manufacturing method thereof are provided to reduce plating deviation without a rectifier by forming an electroless plating layer. CONSTITUTION: A lead unit is comprised of a vertical unit and a horizontal unit. A die pad unit is shorted with the lead unit by a support unit made of insulation materials. An inner lead(190a) is formed on the upper side of the horizontal unit of the lead unit. An outer lead(190b) is formed on the lower side of the vertical unit of the lead unit. The inner lead is extend to surround the side of the horizontal unit in a die pad direction and has a gap with the side of the horizontal unit. |
