发明名称 |
Substrate processing apparatus and substrate processing method |
摘要 |
A substrate processing apparatus includes: a polishing device 30A for polishing the surface of a substrate; and at least one of an ultrasonic cleaning device 42 for cleaning the surface of the substrate with ultrasonic waves transmitted through a liquid, and a two-fluid jet cleaning device 44 for cleaning the surface of the substrate with a two-fluid jet spouted as a mixture of a gas and a liquid. A substrate processing method includes: a polishing step of polishing the surface of a substrate; and a solid matter noncontact cleaning step of cleaning the surface of the substrate by spraying a liquid to the surface of the substrate. The above apparatus and method make it possible to efficiently clean the surface of a substrate after it is polished. |
申请公布号 |
US8226771(B2) |
申请公布日期 |
2012.07.24 |
申请号 |
US20070225241 |
申请日期 |
2007.03.06 |
申请人 |
OIKAWA FUMITOSHI;KAJITA SHINJI;EBARA CORPORATION |
发明人 |
OIKAWA FUMITOSHI;KAJITA SHINJI |
分类号 |
B08B3/12;B08B11/02 |
主分类号 |
B08B3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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