| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer mount manufacturing method which accurately manufactures wafer mounts with an inexpensive structure. <P>SOLUTION: A liquid adhesive is applied to a circuit surface of a semiconductor wafer, and a support plate is bonded to an application surface. The support plate is held and a rear surface of the semiconductor wafer is ground. The semiconductor wafer is supported on a ring frame through a support adhesive tape and the support plate is separated from the semiconductor wafer. Further, a peeling tape having a width which is larger than a diameter of the semiconductor wafer is applied to the film like adhesive on the semiconductor wafer. When the peeling tape is peeled, the adhesive is peeled from the semiconductor wafer being integrated with the peeling tape. <P>COPYRIGHT: (C)2012,JPO&INPIT |
