发明名称 LOW TEMPERATURE CURABLE ADHESIVE COMPOSITIONS
摘要 <p>The present invention is concerned with curable adhesive compositions for anchoring elements in a structural body that exhibit low temperature versus standard temperature degree of cures that are at least 50% or higher. The compositions include, in a first component, a reactive resin, an acetoacetoxy functional monomer and a silane monomer. By using phthalate-free constituents in the formulation, a further 10% increase in strength and durability of the resins at standard temperatures may be realized after curing at low temperatures.</p>
申请公布号 WO2012097186(A1) 申请公布日期 2012.07.19
申请号 WO2012US21129 申请日期 2012.01.12
申请人 SIMPSON STRONG-TIE COMPANY, INC.;HIBBEN, QUENTIN, L. 发明人 HIBBEN, QUENTIN, L.
分类号 C09D133/06 主分类号 C09D133/06
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