| 发明名称 |
PHOTOSENSITIVE ADHESIVE COMPOSITION HAVING ALKALI SOLUBLE EPOXY RESIN, AND PATTERNABLE ADHESIVE FILM USING THE SAME |
| 摘要 |
Provided are a photosensitive adhesive composition having an alkali soluble epoxy resin and a patternable adhesive film using the same. The photosensitive adhesive composition has good pattern formability and adhesiveness since the photosensitive adhesive composition includes the alkali soluble epoxy resin. |
| 申请公布号 |
US2012181702(A1) |
申请公布日期 |
2012.07.19 |
| 申请号 |
US201113224636 |
申请日期 |
2011.09.02 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE JAE JUN;PARK JOON YONG;JEONG CHUL HO;HAN YONG SEOK |
| 分类号 |
H01L23/538;G03F7/028 |
主分类号 |
H01L23/538 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
