发明名称 COIL BUILT-IN SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a coil built-in substrate in which a forming layer of a coil conductor 9 is arranged at a location displaced from half the height and deterioration in electric characteristics of the coil conductor as an inductor is inhibited. <P>SOLUTION: A coil built-in substrate 101 comprises a first magnetic material layer 21 in which a coil conductor 9 and a magnetic material are laminated, a first surface layer 31 formed on an electronic component mounted surface side (first principal surface side) and including a surface conductor film 7, and a second surface layer 32 formed on a mounting surface side (second principal surface side) with respect to a wiring board that is a mounting destination and including the surface conductor film 7. A second magnetic material layer 22 is provided between a coil conductor formation layer 21c that is a layer including the coil conductor 9, and the first surface layer 31. Assuming that a distance between the coil conductor formation layer 21c and the first surface layer 31 is represented as A, a distance between the coil conductor formation layer 21c and the second surface layer 32 as B, magnetic permeability of the first magnetic material layer 21 as &mu;1 and magnetic permeability of the second magnetic material layer 22 as &mu;2, there are relationships of A<B, &mu;1<&mu;2. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012138495(A) 申请公布日期 2012.07.19
申请号 JP20100290502 申请日期 2010.12.27
申请人 MURATA MFG CO LTD 发明人 YAZAKI HIROKAZU
分类号 H05K3/46;H01F17/00;H01F17/04 主分类号 H05K3/46
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