| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for processing target objects, which has superior workability in a depth direction with respect to a target object with a heat-mode resist layer and can efficiently form high-definition fine micro-holes or grooves with high aspect ratio. <P>SOLUTION: The method for processing target objects includes: a heat-mode resist layer formation step in which the heat-mode resist layer is formed on top of a substrate; and a micro-hole/groove formation step in which the heat-mode resist layer is irradiated multiple times by laser light, thereby forming micro-holes or grooves. The method has such operation mode as the number of irradiation of the laser light is 2-1,000 times or a linear speed of the laser is 100 m/s or less. <P>COPYRIGHT: (C)2012,JPO&INPIT |
