| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sputtering device which enables the improvement in film formation rate while preventing the damage of the surface of a substrate. <P>SOLUTION: The sputtering device includes: a magnetic field generation sections 1 (1a, 1b) in which a pair of members are so arranged as to face each other apart from each other by a given space and can generate a magnetic field in the space; a film-formed member-holding part, in which a member 6 on which a film is to be formed can be arranged so as to face the space on the side of the pair of members; a target member 2 which is arranged in the space and has a target surface 2a that is inclined toward the member 6; and an electric power supply section 3 which is connected to the target member 2 and can apply a voltage to the target member 2. <P>COPYRIGHT: (C)2012,JPO&INPIT |
