| 摘要 |
A light-emitting diode package (100) comprises: a substrate (110) including a first surface (110a) and a second surface (110b); a light-emitting chip (160) mounted on the first surface; and an electrode pad portion (140) that is disposed on the second surface and electrically connects the light-emitting chip to an external device, wherein the electrode pad portion has a shape with rotational symmetry with respect to a predetermined angle when a normal line running through a center of the second surface is used as a rotation axis.
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