LAMINATION LAYER TYPE HEAT SINK STRUCTURE FOR ELECTRONIC APPLIANCE

摘要

PURPOSE: A heat sink structure for an electronic device of a stacked mode is provided to effectively release heat inside the electronic device by including an insert type heat pad laminated between a thermal conductor and a heat radiation plate. CONSTITUTION: A heat radiation plate(10) is settled at the upper side of a main board(2). The heat radiation plate releases heat generated in the main board to outside. A heat conducting plate is attached to the lower side of an upper plate(1a) of an electronic device. The heat conducting plate releases heat within the electronic device to outside through conduction. An insert type heat pad(30) is laminated on the bottom of the upper plate of the electronic device. The insert type heat pad transmits the heat which is conducted along the heat radiation plate to the heat conducting plate.