| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component built-in module which is excellent in humidity resistance and makes connection failure less likely to be caused even if the component built-in module is attached to a curve surface part. <P>SOLUTION: A component built-in module has: a flexible substrate having a first surface and a second surface which is different from the first surface; one or more recessed parts protruding from the first surface of the flexible substrate toward the second surface; electronic components mounted in the recessed parts of the first surface of the flexible substrate; a first resin sealing the first surface of the flexible substrate and the mounted electronic components; and a second resin sealing the second surface of the flexible substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
