发明名称 |
ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREFOR |
摘要 |
An electronic component module includes a substrate including a first electrode pattern and a first resist pattern on a first main surface thereof, a first electronic component mounted on the first main surface via the first electrode pattern, and a component-embedding resin layer provided on the first main surface so as to embed the first electronic component therein, and including, in an inside portion or a lateral portion thereof, an interlayer connection conductor connecting the first electrode pattern and an external connection electrode pattern disposed on a surface of the component-embedding resin layer to each other. The first electrode pattern and the first resist pattern are arranged so that the first resist pattern is disposed on top of a circumferential portion of the first electrode pattern. |
申请公布号 |
US2012176751(A1) |
申请公布日期 |
2012.07.12 |
申请号 |
US201213415886 |
申请日期 |
2012.03.09 |
申请人 |
SAKAI NORIO;NISHIHARA MAYUKO;MURATA MANUFACTURING CO., LTD. |
发明人 |
SAKAI NORIO;NISHIHARA MAYUKO |
分类号 |
H05K7/06;H05K3/30;H05K3/46 |
主分类号 |
H05K7/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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