发明名称 |
Light-emitting device package and method of manufacturing the same |
摘要 |
A light-emitting device package includes: a package body (2) on which a mount portion (210) and a terminal portion (220) are disposed; a light-emitting device chip (300) that is mounted on the mount portion; and a bonding wire (401) that electrically connects an electrode of the light-emitting device chip and the terminal portion. The bonding wire includes a rising portion (410) that rises from the light-emitting device chip to a loop peak (412), and an extended portion (440) that connects the loop peak and the terminal portion. A first kink portion (413), which is bent in a direction intersecting a direction in which the rising portion rises, is disposed on the rising portion (410). |
申请公布号 |
EP2475018(A2) |
申请公布日期 |
2012.07.11 |
申请号 |
EP20120150120 |
申请日期 |
2012.01.04 |
申请人 |
SAMSUNG LED CO., LTD. |
发明人 |
LIM, JAE-YUN;OH, KOOK-JIN;LEE, JOON-GIL |
分类号 |
H01L33/62;H01L23/00 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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