LIGHT EMITTING DIODE PACKAGING STRUCTURE AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A light emitting diode packaging structure and a manufacturing method thereof are provided to reduce manufacturing cost by gaining optical effect with a traditional remote phosphor configuration through a sealant molding manufacture process. CONSTITUTION: At least one or more light emitting diode chips(403) are fixed on a substrate(404). A lens(410) to cover the light emitting diode chip is installed on the substrate. The lens is composed of a transparent sealant. At least one or more in-mold decoration films(40) are attached on the lens. The in-mold decoration film includes at least one of a fluorescent substance layer(401), a surface processing layer(406) and an adhesive layer(405).