| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve cooling efficiency of a semiconductor cooling device with a simple structure. <P>SOLUTION: A semiconductor cooling device comprises a semiconductor element cooling plate 20 at which a semiconductor element 10 is attached to a top face 21 and protrusions 23 for cooling are provided on an undersurface 22, a base plate 32 contacting each of cooling water passage side walls 40a and the protrusions 23 of the semiconductor element cooling plate 20 to separate space 64 between the semiconductor element cooling plate 20 and the base plate 32, and a division plate 31 protruded from the base plate 32 and extending in a flow direction of cooling water to divide a cooling water passage 60. By providing a cooling water passage division member 30 arranged to leave spaces 63, 65 between side end faces of the base plate 32 and inner faces of the cooling water passage side walls 40a, respectively, the semiconductor element 10 is cooled by the cooling water. <P>COPYRIGHT: (C)2012,JPO&INPIT |
