| 摘要 |
<p>PURPOSE: A semiconductor package and a manufacturing method thereof are provided to improve joint performance of a mother board by filling a dimple with solder around a solder joint in advance. CONSTITUTION: A semiconductor package is molded to expose the bottom and the outer side of a lead(14). A solder ball is attached to a dimple(22) formed on the bottom and the outer side of the lead. The dimple is filled with a conductive solder(26) by melting a solder ball through a reflow process. The lead filled with the conductive solder is sawed. A board is mounted on a mother board when the dimple of the lead is filled with conductive solder.</p> |
