| 摘要 |
<p>PURPOSE: A semiconductor package and a manufacturing method thereof are provided to reduce manufacturing costs of a semiconductor package by combining a semiconductor chip with a heat sink by a molding member without a separate combining member. CONSTITUTION: A first semiconductor chip(120) is mounted on a substrate(110). The first semiconductor chip includes a first side(F1) and a second side(F2) facing the first side. A second semiconductor chip(130) is arranged between the second side and the substrate. A heat sink(150) is arranged on the first semiconductor chip. A mold of a molding apparatus includes an upper mold, a lower mold, and an intermediate mold(230).</p> |
