发明名称 |
Heat transfer for a hard-drive pre-amp |
摘要 |
A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom. |
申请公布号 |
US8213125(B2) |
申请公布日期 |
2012.07.03 |
申请号 |
US201113214120 |
申请日期 |
2011.08.19 |
申请人 |
MCCASLIN MARTIN JOHN;HU SZU-HAN;CAYABAN ALEX ENRIQUEZ;HO VOON YEE;NITTO DENKO CORPORATION |
发明人 |
MCCASLIN MARTIN JOHN;HU SZU-HAN;CAYABAN ALEX ENRIQUEZ;HO VOON YEE |
分类号 |
G11B5/55 |
主分类号 |
G11B5/55 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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