发明名称 CORE MATERIAL FOR A VACUUM INSULATION PANEL FORMED OF A PHENOLIC RESIN-CURED FOAM AND VACUUM INSULATION PANEL USING SAME, AND METHOD FOR MANUFACTURING SAME
摘要 The present invention relates to a core material for a vacuum insulation panel formed of a phenolic resin-cured foam and to a vacuum insulation panel using same, and to a method for manufacturing same. Particularly, the core material is formed of a phenolic resin-cured foam having a closed cell content of about 20% or less. Also, a cell thereof has a mean particle size of about 50 µm to about 500 µm, and a fine hole having a size of about 0.5 µm to about 30 µm is defined in the surface of the cell. Thus, the phenolic resin-cured foam may have a porosity of about 50% or more to provide superior insulation performance, ensure structural strength, and reduce manufacturing costs.
申请公布号 WO2012086954(A2) 申请公布日期 2012.06.28
申请号 WO2011KR09481 申请日期 2011.12.08
申请人 LG HAUSYS, LTD.;KIM, JUNG-KEUN;LEE, EUNG-KEE;LEE, MIN-HEE;KIM, MYEONG-HEE 发明人 KIM, JUNG-KEUN;LEE, EUNG-KEE;LEE, MIN-HEE;KIM, MYEONG-HEE
分类号 C08J9/00;B32B5/18;C08L61/04;E04B1/78 主分类号 C08J9/00
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