发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSING APPARATUS
摘要 <p>PURPOSE: A method for manufacturing a semiconductor device and a substrate processing device are provided to obtain the uniformity of oxidizing power by supplying O2 gas and H2 gas from a nozzle to a processing chamber. CONSTITUTION: A heater(207) heats a substrate in a processing container. A source gas supply system supplies source gas including a preset element to the processing container. An oxygen containing gas supply system supplies gas with oxygen to the processing container. A hydrogen containing gas supply system supplies gas with hydrogen to the processing container. A pressure control unit controls the pressure of the processing container.</p>
申请公布号 KR20120069642(A) 申请公布日期 2012.06.28
申请号 KR20120058991 申请日期 2012.06.01
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 AKAE NAONORI;HIROSE YOSHIRO;TAKASAWA YUSHIN;OTA YOSUKE
分类号 H01L21/316;H01L21/205;H01L21/8247;H01L27/115 主分类号 H01L21/316
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