| 摘要 |
<p>PURPOSE: A positive photo-resist composition is provided to improve sensitivity and to reduce failure rate by stably securing thermal distribution. CONSTITUTION: A positive photo-resist composition includes a first alkali soluble resin represented by chemical formula 1, a second alkali soluble resin, a dissolution inhibitor, and a solvent. The polystyrene-reduced weight average molecular weight of the first alkali soluble resin is between 1,000 and 5,000. In chemical formula 1, R9 to R14 are respectively hydrogen atoms, C1 to C6 linear or branched alkyl groups, C1 to C6 linear or branched alkoxy groups, or C3 to C6 cycloalkyl groups; R16 to R18 are respectively selected from a group including hydrogen atoms, C1 to C6 linear or branched alkyl groups, and C6 to C18 aryl groups; N is 10 to 200.</p> |
