发明名称 Components packaging method
摘要 A tools holding member 63 which holds replacement tools 23a, 34a, 44a for a pick-up head 22, a mounting head 33 and a stamping head 44 which are provided so as to move freely in a Y-axis direction in which a components supply stage 3 and a substrate holding stage 4 are aligned is provided on an overlapping area R of a moving area R1 over which the pick-up head 22 can move, a moving area R2 over which the mounting head 33 can move and a moving area R3 over which the stamping head 43 can move which lies on a moving table 15 which is provided in an area R0 lying between the components supply stage 3 and the substrate holding stage 4 so as to move freely in an X-axis direction which is at right angles to a Y-axis.
申请公布号 US8205328(B2) 申请公布日期 2012.06.26
申请号 US20100791376 申请日期 2010.06.01
申请人 HIRAKI TSUTOMU;PANASONIC CORPORATION 发明人 HIRAKI TSUTOMU
分类号 H05K3/30 主分类号 H05K3/30
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