| 摘要 |
PURPOSE: A method for electroplating a uniform copper layer is provided to uniformly deposit copper on the knee and wall of a through hole by adding a leveler in a copper electroplating composition. CONSTITUTION: A method for electroplating a uniform copper layer comprises the steps of: preparing an electroplating composition which comprises one or more copper ion sources, 5-100ppb of 3-mercapto propane sulphonic acid, salt thereof or a mixture thereof, one or more additional brighteners, and one or more levelers, dipping a substrate with through holes in the electroplating composition, coating the walls and knees of the through holes with a first copper layer, and electroplating a uniform second copper layer on the first copper layer of the walls and knees of the through holes. |
