HALOGEN-FREE ADHESIVE COMPOSITION AND COVERLAY FILM AND COPPER CLAD LAMINATE USING THE SAME

摘要

PURPOSE: A halogen-free adhesive composition is provided not to generated toxic gas at combustion, to have excellent thermal resistance, to reduce production cost, and to be applied to processes requiring UV curing. CONSTITUTION: A halogen-free adhesive composition comprises a halogen-free epoxy resin, a thermoplastic resin, a curing agent, and inorganic filler. The non-halogen epoxy resin is a bisphenol A type epoxy resin and a phosphorous-bound type epoxy resin. The thermoplastic resin is acrylonitrile butadiene rubber. The inorganic filler is aluminum hydroxide or silica. The copper foil laminate plate comprises an insulative substrate film, an adhesive layer spread by the halogen-free adhesive composition one at least one side of the insulative substrate film, and a cooper foil laminated on the adhesive layer.